Connect with us

Scholarships

University Of Hong Kong Juris Doctor Programme Scholarships 2023

Applications are open for interested and suitably qualified candidates for the University Of Hong Kong Juris Doctor Programme Scholarship 2023. The entire application details for the University Of Hong Kong Juris Doctor Programme Scholarships can be accessed below.

University Of Hong Kong Juris Doctor Programme Scholarships

Scholarships Opportunities 2023 Applications are now open!

Admission Scholarship for the Juris Doctor Programme 2023 | City University of Hong Kong is open for International Students, Domestic Students. The scholarship allows Post Doctorate, Ph.D. level programme(s) in the field of All Subjects taught at the City University of Hong Kong. The deadline for the scholarship is Open.

Degree Level:

Admission Scholarship for the Juris Doctor Programme 2023 | City University of Hong Kong is available to undertake Post Doctorate, Ph.D. level programs at the City University of Hong Kong.

Available Subjects:

The following subjects are available to study under this scholarship program.

  • All Subjects

Scholarship Benefits:

There shall be a maximum of 2 scholarships in each academic year. Each recipient will receive a scholarship of HK $50,000. The Scholarship shall be paid to the recipients in two installments: in Semester A of Year One and Semester A of Year Two.

Eligible Nationalities:

All Nationalities

Eligibility Criteria:

  1. All full-time Juris Doctor applicants (local,non-local and international) are eligible to apply for the Scholarships.
  2. A Selection Committee will review applications, and then make a decision for awarding the Scholarship.
  3. The selection of recipients will be based on the consideration of relevant factors, primarily the academic achievements of applicants (i.e.academic performance in an undergraduate degree and/or a postgraduate degree).
READ ALSO  New Zealand University Of Waikato International Excellence Scholarships 2023

How to Apply

interested applicants Should CLICK HERE to apply